Odyssey Electronics Capabilities

SMT

Components: Resistors, capacitors, diodes, SIP, DIP, IC BGA, QFN, LED, QFP, connectors, headers
Component Min/Max Height: 0.1mm (min) - 15mm (max)
Component Min/Max Length: .001mm (min) - 42mm (max)
Component Min/Max Width: .001mm (min) - 42mm (max)
PCB Min/Max Length: 50mm (min) - 550mm (max)
PCB Min/Max Width: 40mm (min) - 430mm (max)
PCB materials: FR materials, flex, rigid flex, CEM materials, aluminum

Inspection types: Normalized correlation, OCV, OCR, barcode recognition and rule-based, real-time SPC data reports
Camera inspection: 2 top down cameras, 4 side view cameras, high magnification camera capable of 01005 component inspection
Solder joint inspection: Min/Max PCB length: 50mm (min)- 560mm (max)
Min/Max PCB width: 0mm (min) - 510mm (max)
Max height: 50mm
Defect detection: Position, presence, wrong, polarity, skewed, tombstoned, bent, lifted, bridged, open, insufficient, short, solder balls

- 100% 3D Inspection of Paste Height And Volume On Entire PCB.

- Real-Time Process Optimization With SPC Analytics

SMT: Passives (0201 and up), fine pitch QFP, micro BGA, etc.
Thru-hole: Axial, radial, flex circuit, connectors, dip, odd form components
Wire Modification: Wire harness, trace wire, cable, connectors
PCB Repair: Pad, barrel, trace, via, thru-hole, SMT

Coating Material: Humiseal 1B73 / Thinner 521
Position Accuracy: +/- 0.05mm (0.002")
Position Repeatability: +/- 0.025mm (0.001")
Minimum/Maximum PCB size: 12.5mm x 12.5mm - 400mm x 400mm
(.5" x .5") - (15.75" x 15.75")
Maximum Component height: 110mm (4.33")
Payload Capacity: 11.4 Kg (25lbs)

: Wiring, mechanical assembly, ETL, calibration, testing, labeling, Kanban, Direct shipping, ETL certified